Numéro
J. Phys. Colloques
Volume 49, Numéro C4, Septembre 1988
ESSDERC 88
18th European Solid State Device Research Conference
Page(s) C4-515 - C4-518
DOI https://doi.org/10.1051/jphyscol:19884107
ESSDERC 88
18th European Solid State Device Research Conference

J. Phys. Colloques 49 (1988) C4-515-C4-518

DOI: 10.1051/jphyscol:19884107

2D BORON DISTRIBUTIONS AFTER ION IMPLANT AND TRANSIENT ANNEAL

P.J. PEARSON et C. HILL

Plessey Research Caswell Ltd, Towcester, Northants, GB-NN12 8EQ, Great-Britain


Abstract
A novel 2D profiling technique of high spatial resolution ( 20 x 20 nm) is used to measure the asymmetry in implanted and transiently annealed boron implants caused by 7° tilt of VLSI wafers during implantation.