Numéro
J. Phys. Colloques
Volume 49, Numéro C4, Septembre 1988
ESSDERC 88
18th European Solid State Device Research Conference
Page(s) C4-101 - C4-104
DOI https://doi.org/10.1051/jphyscol:1988421
ESSDERC 88
18th European Solid State Device Research Conference

J. Phys. Colloques 49 (1988) C4-101-C4-104

DOI: 10.1051/jphyscol:1988421

AN ULTRA HIGH SPEED TRENCH ISOLATED DOUBLE POLYSILICON BIPOLAR PROCESS

M.C. WILSON, S. DUNCAN et P.C. HUNT

Plessey Research (Caswell) Ltd., Caswell, Towcester, Northants, Great-Britain


Abstract
This paper describes a double polysilicon bipolar process incorporating a novel self-aligned emitter-base and deep trench isolation. The process has been designed primarily for ultra high speed by minimising parasitic capacitances, and also offers high packing densities. The performance of the technology is demonstrated by a 1/8 static divider operating at a frequency of 10.7GHz. Other representative SSI functions are also described.