Numéro
J. Phys. Colloques
Volume 49, Numéro C4, Septembre 1988
ESSDERC 88
18th European Solid State Device Research Conference
Page(s) C4-393 - C4-396
DOI https://doi.org/10.1051/jphyscol:1988482
ESSDERC 88
18th European Solid State Device Research Conference

J. Phys. Colloques 49 (1988) C4-393-C4-396

DOI: 10.1051/jphyscol:1988482

PLASMA ANODISATION OF SILICON FOR ADVANCED VLSI

S. TAYLOR1, W. ECCLESTON1, J. RINGNALDA2, D.M. MAHER2, 3, D.J. EAGLESHAM2, C.J. HUMPHREYS2 et D.J. GODFREY4

1  Department of Electrical Engineering and Electronics, Liverpool University, PO Box 147, GB-Liverpool L69 3BX, Great-Britain
2  Department of Material Science and Engineering, Liverpool University, PO Box 147, GB-Liverpool L69 3BX, Great-Britain
3  AT&T Bell Laboratories, Murray Hill, NJ 07974, USA
4  GEC Hirst, Wembley, GB-Middlesex HA9 7PP, Great-Britain


Abstract
Inductively coupled, RF stimulated plasma anodisation of silicon is discussed in terms of both MOS electrical properties and the oxidation of Si3N4/SiO2 /Si materials systems. The electrical properties of the plasma oxides grown at 400°C are comparable to those of thermal oxides grown at 1000°C. Preliminary results based on transmission electron microscopy observations prior to and after plasma anodisation indicate that Si3N4/SiO2 strips on silicon exhibit interesting lateral oxidation behaviour and therefore Si3N4 may be a potential mask against plasma anodisation for advanced VLSI.