Numéro |
J. Phys. Colloques
Volume 49, Numéro C4, Septembre 1988
ESSDERC 8818th European Solid State Device Research Conference |
|
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Page(s) | C4-85 - C4-88 | |
DOI | https://doi.org/10.1051/jphyscol:1988417 |
ESSDERC 88
18th European Solid State Device Research Conference
J. Phys. Colloques 49 (1988) C4-85-C4-88
DOI: 10.1051/jphyscol:1988417
ITT Intermetall, Hans-Bunte-Str. 19, D-7800 Freiburg, F.R.G.
18th European Solid State Device Research Conference
J. Phys. Colloques 49 (1988) C4-85-C4-88
DOI: 10.1051/jphyscol:1988417
CIT 1 AND CIT 2, ADVANCED NON EPITAXIAL BIPOLAR/CMOS PROCESSES FOR ANALOG-DIGITAL VLSI
C. VOLZ et L. BLOSSFELDITT Intermetall, Hans-Bunte-Str. 19, D-7800 Freiburg, F.R.G.
Résumé
Deux processus Bipolaire/CMOS de haute performance ont été développés ; les processus CIT 1 (2.0 µm) et CIT 2 (1.5 µm). La technologie CIT n'utilise ni l'epitaxie ni le buried layer. Des transistors bipolaires (npn, pnp) et des transistors MOS (canal n, canal p) sont implantes avec succes sur un même chip sans diminuer les performances des deux technologies en présence.
Abstract
Two N-well high performance Bipolar/CMOS processes have been developed ; a 2.0 µm CIT 1 process and CIT 2, a 1.5 µm process. CIT technology uses neither epitaxie nor buried layer. Bipolar transistors (npn and pnp) and MOS transistors (n-channel and p-channel) have been sucessfully fabricated on the same chip without a decrease of the performance.