Numéro
J. Phys. Colloques
Volume 42, Numéro C4, Octobre 1981
Proceedings of the Ninth International Conference on Amorphous and Liquid Semiconductors
Page(s) C4-683 - C4-686
DOI https://doi.org/10.1051/jphyscol:19814151
Proceedings of the Ninth International Conference on Amorphous and Liquid Semiconductors

J. Phys. Colloques 42 (1981) C4-683-C4-686

DOI: 10.1051/jphyscol:19814151

INFLUENCE OF HYDROGEN PARTIAL PRESSURE ON DEPOSITION AND PROPERTIES OF SPUTTERED AMORPHOUS GALLIUM ARSENIDE

L. Alimoussa1, H. Carchano1 and J.P. Thomas2

1  Laboratoire de Photoélectricité, Equipe "Matériaux Amorphes", Faculté des Sciences et Techniques de Saint-Jérôme, 13 rue Poincaré, 13397 Marseille Cedex 13, France
2  Institut de Physique Nucléaire, Université de Lyon I, 43 bd du 11 novembre 1918, 69622 Villeurbanne Cedex, France


Abstract
Thin film of a GaAs H are produced by rf sputtering of a monocrystalline undoped target (ρ ≈ 5 x 107 Ωxcm). We have correlated the hydrogen pressure PH of the discharge with the H concentration CH in the film from nuclear reaction of 15N. Study of growth rate variation with PH shows a decrease from 3 Å/S to about 1 Å/S when hydrogen is added to argon. -a-GaAs-H is strongly absorbent (α > 105 cm-1 at 2 eV). The optical gap E0 increases with PH from 0.91 eV and saturates to 1.45 eV when PH > 40 % of total pressure.