Numéro |
J. Phys. Colloques
Volume 42, Numéro C4, Octobre 1981
Proceedings of the Ninth International Conference on Amorphous and Liquid Semiconductors
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Page(s) | C4-627 - C4-630 | |
DOI | https://doi.org/10.1051/jphyscol:19814137 |
J. Phys. Colloques 42 (1981) C4-627-C4-630
DOI: 10.1051/jphyscol:19814137
PREPARATION AND PROPERTIES OF ION BEAM DEPOSITED a-SiHx
G.P. Ceasar, K. Okumura and S.F. GrimshawXerox Webster Research Center, Webster, New York 14580, U.S.A.
Abstract
Ion beam deposition (IBD) has been used to prepare a-SiHx thin films over a range of deposition conditions. Concentration of hydrogen in the ion beam is found to be a major factor in determining the properties of these materials. Increasing the hydrogen concentration of the ion beam from 0 to 75% produces a monotonic decrease in room temperature dark conductivity from 10-3 to 10-10 (Ωcm)-1. This is accompanied by an increase in the optical band gap from 1.2 to 1.8 eV and a decrease in the esr spin density to < 1017cm-3. Monohydride SiH bonding predominates in the ir spectra with no evidence for polysilane coordination. Densities are greater than 2.2 g/cm3 for all films made in this study suggesting an absence of voids. Phase contrast TEM gives no indication of columnar morphology.