Numéro |
J. Phys. Colloques
Volume 49, Numéro C5, Octobre 1988
Interface Science and Engineering '87An International Conference on the Structure and Properties of Internal Interfaces |
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Page(s) | C5-471 - C5-479 | |
DOI | https://doi.org/10.1051/jphyscol:1988559 |
An International Conference on the Structure and Properties of Internal Interfaces
J. Phys. Colloques 49 (1988) C5-471-C5-479
DOI: 10.1051/jphyscol:1988559
GRAIN BOUNDARY CHEMISTRY CONTRIBUTIONS TO INTERGRANULAR HOT CRACKING
R.G. THOMPSON, B. RADHAKRISHNAN et D.E. MAYOUniversity of Alabama at Birmingham, Department of Materials Engineering, Birmingham, AL 35294, U.S.A.
Abstract
This report presents recent findings concerning the role of intergranular chemistry in the mechanism of intergranular hot cracking IHC during welding. The IHC of the weld heat affected zone during welding has long been suspected of some relationship to residual elements. Until now, that relationship in nickel alloys had been lost due to the roles that bulk concentration, volume fraction of second phase, and heat treatment played in establishing the intergranular chemistry of the alloy. Experiments in this study correlated the IHC susceptibility with bulk sulfur and heat treatment. It is shown that increasing sulfur from 0.0008 to 0.009 weight percent caused a modest increase in IHC. However, heat treatment had a three fold greater effect on IHC than the sulfur range tested. It is postulated that, although an increase in bulk sulfur increases the intergranular sulfur level, heat treatment has a more potent effect on IHC through combined segregation and precipitation reactions. Auger spectroscopy, metallography, and IHC data are presented in defense of these arguments.