| Numéro |
J. Phys. Colloques
Volume 46, Numéro C10, Décembre 1985
Eighth International Conference on Internal Friction and Ultrasonic Attenuation in Solids
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|---|---|---|
| Page(s) | C10-809 - C10-812 | |
| DOI | https://doi.org/10.1051/jphyscol:198510177 | |
Eighth International Conference on Internal Friction and Ultrasonic Attenuation in Solids
J. Phys. Colloques 46 (1985) C10-809-C10-812
DOI: 10.1051/jphyscol:198510177
1 Ohio State University, Department of Welding Engineering, Columbus, OH 43210, U.S.A.
2 Department of Materials Engineering, Ben-Gurion University of the Negev, PO Box 653, Beer-Sheva, 84105, Israel
J. Phys. Colloques 46 (1985) C10-809-C10-812
DOI: 10.1051/jphyscol:198510177
STUDY OF VISCOELASTIC PROPERTIES OF THIN INTERFACE LAYERS BY ULTRASONIC WAVES
S. I. ROKHLIN1, 21 Ohio State University, Department of Welding Engineering, Columbus, OH 43210, U.S.A.
2 Department of Materials Engineering, Ben-Gurion University of the Negev, PO Box 653, Beer-Sheva, 84105, Israel
Abstract
An ultrasonic method for evaluation of interface properties is outlined. The method is based on utilization of ultrasonic interface waves for bonded semispaces and of Lamb waves for bonded layers. The interface wave induces only shear stresses on the interface, which makes it possible to estimate the effective complex shear modulus of the interface. The technique is applied for evaluation of viscoelastic properties of thin polymer adhesive films between solids.