| Numéro |
J. Phys. Colloques
Volume 49, Numéro C3, Septembre 1988
DYMAT 88 - 2nd International Conference on Mechanical and Physical Behaviour of Materials under Dynamic Loading
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|---|---|---|
| Page(s) | C3-289 - C3-294 | |
| DOI | https://doi.org/10.1051/jphyscol:1988341 | |
DYMAT 88 - 2nd International Conference on Mechanical and Physical Behaviour of Materials under Dynamic Loading
J. Phys. Colloques 49 (1988) C3-289-C3-294
DOI: 10.1051/jphyscol:1988341
Institute of Physics of Solids and Semiconductors, Academy of Sciences of the BSSR, 210023, Vitebsk, Ljudnikova 13, BSSR
J. Phys. Colloques 49 (1988) C3-289-C3-294
DOI: 10.1051/jphyscol:1988341
SMOOTH SPALLATION RESULTING FROM COLLISIONS OF COPPER PLATES
I.D. ZAKHARENKOInstitute of Physics of Solids and Semiconductors, Academy of Sciences of the BSSR, 210023, Vitebsk, Ljudnikova 13, BSSR
Résumé
Dans le travail l'auteur examine les processus lors de la collision des plaques métalliques ayant la vitesse 800-400 m/s. Dans l'expérience on a découvert le phénomène de la formation des fendilles unies grâce au scindement lors de la collision des plaques de cuivre subies préalablement le traitement thermique et qui ont la même épaisseur.
Abstract
The author examines the processes occuring during the collision of the metal plates with the speed 800-400 m/s. The experiment showed the formation of smooth cracks due to the collision of heat-treated copper plates with equal thickness.