J. Phys. Colloques
Volume 46, Number C10, Décembre 1985Eighth International Conference on Internal Friction and Ultrasonic Attenuation in Solids
|Page(s)||C10-167 - C10-170|
J. Phys. Colloques 46 (1985) C10-167-C10-170
TEMPERATURE DEPENDENCE OF THE DISLOCATION CONTRIBUTION TO THE MODULUS DEFECTG.L. WIRE1 and A.V. GRANATO2
1 Materials Technology, IIT Research Institute, Chicago, IL 60616, U.S.A.
2 Dept. of Physics, University of Illinois, Urbana, IL 61801, U.S.A.
The dislocation contribution to the modulus defect ƊG/G has been found to be temperature dependent. It is shown that a temperature dependent modulus defect in reasonable agreement with experiment can be obtained by calculating the thermally averaged displacement [MATH] for a string model with Cottrell pinning point interactions using classical statistical mechanics.