A TEM STUDY OF DIFFUSION-INDUCED GRAIN BOUNDARY MIGRATION IN Ni-Cu DIFFUSION COUPLES D. LIU, W. A. MILLER et K. T. AUSTJ. Phys. Colloques, 49 C5 (1988) C5-635-C5-640DOI: https://doi.org/10.1051/jphyscol:1988581
