Numéro
J. Phys. Colloques
Volume 51, Numéro C1, Janvier 1990
Proceeding of the International Congress
Intergranular and Interphase Boundaries in materials
Page(s) C1-593 - C1-598
DOI https://doi.org/10.1051/jphyscol:1990193
J. Phys. Colloques 51, C1-593-C1-598 (1990)
DOI: 10.1051/jphyscol:1990193

ANALYSIS OF MULTIPLE SLIP IN COPPER TRICRYSTALS

T. OHASHI

Hitachi Research Laboratory, Hitachi, Ltd. 4026, Kuji, Hitachi, 319-12, Japan


Abstract
Non-uniform multiple slip in tricrystals is analysed by a method of continuum mechanics. Analysis results show that compatibility requirements on the grain boundary planes and on the entire tricrystal specimen lead to different types of multiple slip. A mechanism for multiple slip is discussed from the view point of excess stress which is generated by the slip on the primary system.