| Numéro |
J. Phys. Colloques
Volume 49, Numéro C5, Octobre 1988
Interface Science and Engineering '87An International Conference on the Structure and Properties of Internal Interfaces |
|
|---|---|---|
| Page(s) | C5-693 - C5-698 | |
| DOI | https://doi.org/10.1051/jphyscol:1988591 | |
Interface Science and Engineering '87
An International Conference on the Structure and Properties of Internal Interfaces
J. Phys. Colloques 49 (1988) C5-693-C5-698
DOI: 10.1051/jphyscol:1988591
1 Department of Metallurgy and Materials Science, University of Toronto.
2 Department of Mechanical Engineering, Faculty of Engineering, Doshisha University, Kyoto 602, Japan
3 Department of Engineering Science, Faculty of Engineering, Kyoto University, Kyoto 606, Japan
An International Conference on the Structure and Properties of Internal Interfaces
J. Phys. Colloques 49 (1988) C5-693-C5-698
DOI: 10.1051/jphyscol:1988591
EFFECT OF GRAIN-BOUNDARY STRUCTURE ON STRESS CORROSION CRACKING IN αCu-Al ALLOY BICRYSTALS
T. MIMAKI1, M. YAMASHITA2, S. HASHIMOTO3 et S. MIURA31 Department of Metallurgy and Materials Science, University of Toronto.
2 Department of Mechanical Engineering, Faculty of Engineering, Doshisha University, Kyoto 602, Japan
3 Department of Engineering Science, Faculty of Engineering, Kyoto University, Kyoto 606, Japan
Abstract
Intergranular stress-corrosion-cracking (SCC) of Cu-9at.%Al alloy was studied in <110>-symmetrical tilt bicrystals having low-angles 3.7°, 8.6°, CSL/Σ=3(111), Σ=9(221), Σ=11(311) boundaries with various grain boundary energies. The Σ=3, 9 and 11 bicrystals were fractured intergranularly. The intergranular fractures did not occur until the applied stresses higher than the yield stresses. The grain boundary energy reflected the susceptibility to intergranular SCC in a lower stress level. Especially, the Σ=3 boundary showed a higher resistance to the initiation of intergranular SCC. The small-angle tilt bicrystals had an extremely lov susceptibility to intergranular SCC even under a high level of stress ratios.