| Numéro |
J. Phys. Colloques
Volume 49, Numéro C5, Octobre 1988
Interface Science and Engineering '87An International Conference on the Structure and Properties of Internal Interfaces |
|
|---|---|---|
| Page(s) | C5-677 - C5-680 | |
| DOI | https://doi.org/10.1051/jphyscol:1988588 | |
Interface Science and Engineering '87
An International Conference on the Structure and Properties of Internal Interfaces
J. Phys. Colloques 49 (1988) C5-677-C5-680
DOI: 10.1051/jphyscol:1988588
1 Dept. of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, IL 61801, U.S.A.
2 D.S.Shih, General Electric, Cincinnati, Ohio.
An International Conference on the Structure and Properties of Internal Interfaces
J. Phys. Colloques 49 (1988) C5-677-C5-680
DOI: 10.1051/jphyscol:1988588
DYNAMIC STUDIES OF DEFORMATION AND FRACTURE AT GRAIN BOUNDARIES
I.M. ROBERTSON1, G.M. BOND1, T.C. LEE1, D.S. SHIH1, 2 et H.K. BIRNBAUM11 Dept. of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, IL 61801, U.S.A.
2 D.S.Shih, General Electric, Cincinnati, Ohio.
Abstract
The interactions of dislocations with grain boundaries in Ni, Ni3Al, alpha-Ti and Ni-S, are being studied by the technique of in-situ TEM deformation. Under certain conditions, grain boundaries act as effective barriers to dislocation motion, resulting in incorporation of glide dislocations into the grain boundary without slip generation in the adjacent grain. The mechanism of stress relief at the boundary depends on the boundary microchemistry and the test conditions. Stress relief may occur by the nucleation and propagation of a crack along the boundary or by the sudden, massive generation of dislocations into the adjacent grain : the dislocation sources are in and adjacent to the grain boundary.