Eighth International Conference on Internal Friction and Ultrasonic Attenuation in Solids
J. Phys. Colloques 46 (1985) C10-167-C10-170
DOI: 10.1051/jphyscol:19851038
TEMPERATURE DEPENDENCE OF THE DISLOCATION CONTRIBUTION TO THE MODULUS DEFECT
G.L. WIRE1 et A.V. GRANATO21 Materials Technology, IIT Research Institute, Chicago, IL 60616, U.S.A.
2 Dept. of Physics, University of Illinois, Urbana, IL 61801, U.S.A.
Abstract
The dislocation contribution to the modulus defect ƊG/G has been found to be temperature dependent. It is shown that a temperature dependent modulus defect in reasonable agreement with experiment can be obtained by calculating the thermally averaged displacement [MATH] for a string model with Cottrell pinning point interactions using classical statistical mechanics.