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Article cité :

Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions

Yi-Wun Wang, Hua-Tui Liang, Kai-Chia Chang, Guo-Wei Wu, Tzu-Ting Tseng and Yi Chen
Journal of Electronic Materials 52 (6) 4000 (2023)
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Phase-field crystal study on the influence of nanoscale intergranular structures on grain boundary segregation

Shasha Su, Sai Tang, Chaoping Liang, Yunzhu Ma and Wensheng Liu
Modelling and Simulation in Materials Science and Engineering 29 (8) 085009 (2021)
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Sulfur – Induced embrittlement in high-purity, polycrystalline copper

Thorsten Meiners, Zirong Peng, Baptiste Gault, Christian H. Liebscher and Gerhard Dehm
Acta Materialia (2018)
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Nanometer-Scale Sliding and Inherent Viscosity of [001] Symmetric Tilt Boundaries in Cu with Boundary Particles

R. Monzen and N. Takada
Materials Transactions, JIM 38 (11) 978 (1997)
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Effect of an element addition on relaxation of elastic distortion based on particle-blocked grain boundary sliding

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Molecular dynamic study of grain boundary embrittlement for [101] tilt copper bicrystals induced by bismuth segregation

Ba-yi Peng, Xi-jun Wu, Fu-xin Zhou and Qi-heng Tang
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A new type of brittle fracture in a fcc metal bicrystal with intergranular segregation

Jian-Sheng Wang
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