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A TEM STUDY OF DIFFUSION-INDUCED GRAIN BOUNDARY MIGRATION IN Ni-Cu DIFFUSION COUPLES

D. LIU, W.A. MILLER and K.T. AUST

J. Phys. Colloques, 49 C5 (1988) C5-635-C5-640

DOI: 10.1051/jphyscol:1988581

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