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Cited article:

COOL PLASMA ACTIVATED SURFACE IN SILICON WAFER DIRECT BONDING TECHNOLOGY

G.-L. SUN, J. ZHAN, Q.-Y. TONG, S.-J. XIE, Y.-M. CAI, S.-J. LU

J. Phys. Colloques, 49 C4 (1988) C4-79-C4-82

DOI: https://doi.org/10.1051/jphyscol:1988416

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