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Cited article:

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Atomic diffusion, segregation, and grain boundary migration in nickel-based alloys from molecular dynamics simulations

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Grain boundary diffusion in bilayered Ag/Cu thin film under diffusion-induced and intrinsic stresses

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Influence of Deformation Mode on Hot Deformation Behavior of CP Titanium

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Cu–Cu Bonding in Ambient Environment by Ar/N2 Plasma Surface Activation and Its Characterization

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Size-Dependent Effects in Low-Temperature Sintering and Alloying of Nanopowders

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Zn Penetration in Liquid Metal Embrittled TWIP Steel

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