Supplément au Journal de Physique Colloques

A COMPARISON OF TRENCH FILLING MATERIALS FOR SUB-MICRON CMOS

P.H. BOLBOT, M.C. ROBERTS and P.L. MEDHURST

J. Phys. Colloques, 49 C4 (1988) C4-537-C4-540

DOI: 10.1051/jphyscol:19884112

P.H. BOLBOT

M.C. ROBERTS

P.L. MEDHURST

Articles written by ALL the selected authors (AND)

Articles written by ANY OF the selected authors (OR)